As a filler for sintered ceramic structural components, its high sphericity enhances density, refines grains to optimize mechanical and thermal conductivity, reduces sintering temperature, and is suitable for high thermal conductivity insulating ceramic parts
Application features：Increases packing density, reduces porosity, and strengthens densification; refines grains to balance mechanical properties and thermal conductivity; lowers sintering temperature in the process and reduces structural deformation.
Application industry：Keyword copy description
Application Details
Submicron spherical aluminum acts as the core powder filler in sintered ceramic structural components, with outstanding application features and strong adaptability:
High sphericity and narrow particle size distribution can enhance powder packing density, significantly reduce sintered porosity, and markedly improve ceramic density and structural uniformity.
The submicron particle size can effectively refine ceramic grains, simultaneously optimize mechanical properties such as flexural strength and compressive strength, as well as thermal conductivity, balancing structural strength and heat transfer efficiency.
It can reduce the sintering activation energy of ceramics, enabling low-temperature sintering and mitigating issues like abnormal grain growth and structural deformation caused by high-temperature processes.
