Submicron spherical silica serves as the core filler in epoxy molding compounds. It can reduce shrinkage, coefficient of thermal expansion, and water absorption, while improving thermal conductivity and system filler loading.

It can be compounded with silica powders of different particle sizes to increase filler loading, significantly reduce the coefficient of thermal expansion of molding compounds, and avoid packaging failure under thermal cycling.

At the same time, it optimizes the thermal conduction path, improves thermal conductivity, accelerates chip heat dissipation, and enhances the thermal stability of the package.

It meets the requirements of advanced packaging for narrow gaps, low warpage, and high reliability, and is widely used in the packaging of logic, memory, and power devices.