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At present, we can supply spherical oxide powders including alumina, silica, magnesia, titania and spherical composite powders such as alumina-magnesia spinel and ZTA in batches.
Home Product Center 产品 Ultrafine spherical alumina powder
Ultrafine spherical alumina powder
Product Overview
There are mainly two series and four major product categories: high-purity and sinterable. The high-purity series is further divided into two categories: DC3 and DC4.
The median particle size (D50) of the powder is controllable within the range of 0.1–10 μm, and the purity of alumina can reach up to 99.999%.


  • Customized on demand：Yes
  • Product Features：It is applied in fields such as thermal conductive materials, transparent ceramics, advanced ceramics, functional fillers, grinding and polishing, ceramic 3D printing, ceramic films, lithium battery separator coatings, light diffusers, and ultraviolet reflective coatings for fluorescent lamps
Consultation details 13916463370
Product Details
Currently, the ultra-fine spherical alumina powder produced and sold by SRP mainly covers two series with four major product categories: High-Purity Series and Sinterable Series.
The High-Purity Series is divided into two categories: DC3 and DC4. The powder’s D50 is controllable within the range of 0.1–10 μm, with a maximum purity of 99.999%.
Products in the High-Purity Series can be surface-modified according to specific customer requirements, and are available in the form of suspension or granulated powder.
The Sinterable Series is categorized into DCS3 and DCS4. The powder’s D50 is controllable between 0.1–5 μm. Impurity content and sintering temperature can be tailored to customer needs, with the minimum sintering temperature reaching 1400°C.
Material properties

1. High-Purity Series

• Morphology & Particle Size: Particle size ranges from 0.1–10 μm, featuring high sphericity, narrow particle size distribution, and smooth surface.

• Flowability & Dispersibility: The spherical structure ensures excellent flowability, easy dispersion, and anti-agglomeration, delivering superior filling and processability.

• Thermal Performance: Thermal conductivity of 25–35 W/(m·K) combined with high insulation, suitable for electronic heat dissipation and encapsulation applications.

• Mechanical Performance: High hardness, wear resistance, and mechanical strength, effectively enhancing the wear resistance of composite materials.

• Filling Characteristics: High packing density and strong interfacial bonding with resins/rubbers, improving the overall performance of composite materials.

2. Sinterable Series

Adopts a new direct combustion technology with surface activation, retaining the high purity of spherical powder while significantly reducing the sintering temperature of high-purity spherical powder.

High sintered density, high material filling rate, and favorable flowability.