Submicron spherical silica is a key functional filler for high-end Copper Clad Laminates (CCL), leveraging its core properties of low dielectric constant, low coefficient of thermal expansion, high sphericity, and excellent dispersibility.
It caters to the core requirements of CCLs in 5G/6G, high-frequency and high-speed, automotive electronics, and server applications, such as high-frequency low loss, dimensional stability, heat and humidity resistance, and thin-wall design.
It is a critical raw material for manufacturing high-frequency high-speed CCLs, High-Tg CCL, and Low-CTE CCL
